FU-F1101


1U Rackmount Fanless Chassis for Mini-ITX

· Silent, dust-free & energy-efficient operation
· Simple assembling and easy system integration
· Dual extensive aluminum-made heatsinks
(Primary heatsink for CPU: TDP 35W; secondary heatsink for expansion card: TDP 45W)
· Innovative thermal cooling: Combination of thermal pads and copper thermal blocks
· Support 2.5" hot-swap x2
· Support expansion slot x1



Specification

Front Panel
Power Switch 1
LED Indicators HDD x1; Power x1
USB 2.0 Port 2
Audio In/Out 1
HDD/SSD # and type 2.5'' x2
Compact Flash Cutoff 1
Back Panel
Standard I/O Shield 1(Not Included)
Expansion Slot 1
DB9 port 2
Internal Structure
Heat-transfer Device Heat Block
HDD/SSD # and type 2.5" x2 
Mechanical & Processing
Dimensions W:19.00"(482.8mm) x D:15.60"(397.5mm) x H:1.73"(44.45mm)
Applied M/B Form Factor      Mini-ITX
Material SGCC
Surface Black Wet Paint with Texture Coat
Colour Black / Customizable Colour
Power Solution Option 1
Internal DC Power Board C7(80W) DC Power Board
External AC Adapter 60W: Input(AC 100~240V); Output(DC 12V@5A)
Power Solution Option 2
Internal DC Power Board C7(80W) DC Power Board
External AC Adapter 80W: Input(AC 100~240V); Output(DC 12V@6.67A)
Power Solution Option 3
Internal DC Power Board C4(150W, 19V~24V) DC Power Board
External AC Adapter 90W: Input(AC 100~240V); Output(DC 19V@4.74A)
Power Solution Option 4
Internal DC Power Board C4(150W, 19V~24V) DC Power Board
External AC Adapter 120W: Input(AC 100~240V); Output(DC 19V@6.32A)

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FU-F1101

1U Rackmount Fanless Chassis for Mini-ITX

· Silent, dust-free & energy-efficient operation
· Simple assembling and easy system integration
· Dual extensive aluminum-made heatsinks
(Primary heatsink for CPU: TDP 35W; secondary heatsink for expansion card: TDP 45W)
· Innovative thermal cooling: Combination of thermal pads and copper thermal blocks
· Support 2.5" hot-swap x2
· Support expansion slot x1